Design and Performance Analysis of CMOS, GDI, and PTL Logic Gates at 90nm Technology

Also Available Domains Low Power VLSI

Project Code :TVMABE362

Objective

The objective of this project is to design and analyze logic gates using CMOS, Gate Diffusion Input (GDI), and Pass Transistor Logic (PTL) styles at 90nm technology. It focuses on evaluating key performance parameters such as propagation delay, power consumption, area, and noise margin for each logic style. The designs will be simulated and verified to ensure correct functionality and to measure efficiency accurately. Comparative analysis will highlight the strengths, weaknesses, and trade-offs of CMOS, GDI, and PTL implementations. The overall goal is to identify the most efficient and high-performance logic gate design suitable for advanced VLSI circuits.

Abstract

This work investigates and compares three logic design styles β€” Static CMOS, Gate Diffusion Input (GDI), and Pass Transistor Logic (PTL) β€” for basic logic gates (e.g., AND, OR, XOR, INV) in a 90 nm CMOS technology. Using Cadence Virtuoso for schematic design and simulation, we model and simulate each logic gate under the same process parameters, running DC, transient, and AC analyses. We evaluate performance in terms of propagation delay, power consumption (static and dynamic), power-delay product (PDP), transistor count (area proxy), and output voltage swing. Our results indicate that GDI-based designs achieve significant reductions in transistor count and power, consistent with previous studies showing up to ~45 % area reduction in 90 nm GDI circuits. PTL gates offer compact designs with lower delay in some cases, but suffer from degraded voltage levels due to threshold loss. The study highlights the design-tradeoffs between robustness (CMOS), low-power/area (GDI), and speed/compactness (PTL), and discusses when each style might be preferable in nanoscale VLSI circuits.

NOTE: Without the concern of our team, please don't submit to the college. This Abstract varies based on student requirements.

Specifications

Technology Node

90 nm CMOS process (using BSIM or similar transistor models)

Supply Voltage (VDD)

Typical value (e.g., ~1.0 V or technology-specified)

Logic Gates Designed

Basic gates: INV, AND, OR, XOR (or others) in three styles: CMOS, GDI, PTL

Transistor Count

Compare number of transistors per gate for each style

Propagation Delay

Measure tpLH and tpHL via transient simulations

Power Consumption

Static (leakage) + dynamic switching power for each gate style

Power-Delay Product (PDP)

Energy per switching event = Power Γ— Delay (Wikipedia)

Output Voltage Swing / Signal Integrity

Measure how close the output gets to full rail (VDD, GND) β€” important for PTL / GDI

Noise Margin / Robustness

(Optional) Evaluate robustness under PVT variation β€” process corners, voltage scaling

Area Estimate

Use transistor count + assumed layout area (or relative area) as a proxy

Learning Outcomes

  • Understanding CMOS, GDI, and PTL logic families and their operation

  • Ability to design basic logic gates using different logic styles

  • Knowledge of trade-offs between power, delay, and area

  • Experience in transistor-level design and layout optimization

  • Skills in SPICE simulation and waveform analysis

  • Understanding threshold voltage and signal degradation issues in PTL and GDI

  • Ability to compare performance metrics across logic families

  • Insight into low-power, high-speed VLSI digital design techniques

  • Knowledge of nanometer-scale technology effects (90nm) on logic design

  • Demo Video

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