Low Power High Speed 4 Dimension FinFET SRAM
Objective
The main objective of this project is to decrease the size of chip and to increase the speed by using FinFET Technology
Abstract
In the most of chips contains memory elements. So to decrease
the size of the memory chips, to increase the speed, to reduce (Drain-induced barrier lowering ) DIBL and short channel
effects at lower technology nodes we switch from MOSFETs to FinFETs. By using
FinFETs we get complete control over the channel and the threshold voltage is
lower. There are many other advantages of using FinFETs over MOSFETs like High
drain current, Faster switching speed, Low power consumption. Lower switching
voltage. Here in this paper we compare the speed of a 6T MOSFET SRAM Cell to 6T
FinFET SRAM Cell. All the
designs are implemented using 45nm technology in H-spice
Keywords—MOSFETs, FinFETs, SRAM,
DRAM, SNM, Read, Write
NOTE: Without the concern of our team, please don't submit to the college. This Abstract varies based on student requirements.
Block Diagram
Specifications
Software Requirements:
· H-spice
· Technology files: 45nm
Hardware Requirements:
· Microsoft® Windows XP
· Intel® Pentium® 4 processor or Pentium 4 equivalent with SSE support
· 512 MB RAM
· 100 MB of available disk space
Learning Outcomes
· Introduction to memory cell
· Knowledge on SRAM
· MOS Fundamentals
· NMOS/PMOS/CMOS Technologies
· Transistor level design for read and Write Driver Circuit
· Introduction to Analog Electronics
· Importance of 6T-FinFET SRAM
- H- SPICE tool for design and simulation
- Solution providing for real time problems
· Project Development Skills:
o Problem Analysis Skills
o Problem Solving Skills
o Logical Skills
o Designing Skills
o Testing Skills
o Debugging Skills
o Presentation skills
o Thesis Writing Skills
Related Projects
Paper Publishing
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Disclaimer - Takeoff Edu Group Projects, are not associated or affiliated with IEEE, in any way. The IEEE Projects mentioned here are mentioned in the context of student projects, whose ideas are derived from IEEE publications, and not projects of or by IEEE.
